Automotive
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BlackBerry, Google and Qualcomm join forces to drive advancements in automotive cockpits
BlackBerry Limited announced the availability of a QNX Hypervisor and VIRTIO-based reference design to virtualise Android Automotive OS on the 3rd Generation Snapdragon Automotive Cockpit Platform, helping automakers to deliver the ultimate cockpit experience while accelerating time to market.
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Infineon launches SLS37 V2X hardware security module to safeguard V2X communication
With trends such as electrification, autonomous driving and connected cars, the number of communication interfaces in vehicles is growing whether wired or wireless. However, this development entails new challenges because the numerous communication channels create new attack surfaces increasing the vulnerability of the systems.
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ZF takes 5% stake in Oxbotica as it deploys autonomous passenger shuttles in major cities
ZF is expanding its expertise in the future field of autonomous driving in line with ZF’s “Next Generation Mobility” strategy. To this end, ZF has signed a strategic partnership agreement with Oxbotica, a global provider of autonomous vehicle software, to develop a Level 4 self-driving system which will initially be deployed in passenger shuttles in major cities around the world.
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Trustonic joins Renesas R-car consortium for cybersecurity solutions in the connected vehicle market
Cybersecurity technology provider Trustonic announces the availability of Kinibi 510 on Renesas‘ R-Car Gen3 automotive reference platform. This development will support and enable co-operation and partnerships within the connected car and electric vehicle (EV) ecosystem.
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Renesas unveils automotive gateway solution based on new R-Car S4 SoCs and PMICs
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, unveiled an innovative automotive gateway solution with R-Car S4 system on chips (SoCs) and power management ICs (PMICs) for next-generation vehicle computers, communication gateways, domain servers and application servers.
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New EasyPACK 2B EDT2 power module for traction inverters up to 50 kW
Infineon Technologies AG introduces the automotive qualified EasyPACK 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A . With its featured specs, the module is optimised for inverter applications in hybrid and electric vehicles.
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Growing share of $101bn driver alert systems market revenue driven by passenger cars
A market research and competitive intelligence provider’s market intelligence report states the global driver alert system market is expected to exceed US$101 billion (€86.98 billion) by registering a healthy compound annual growth rate (CAGR) of 14% in the forecast period 2021-2031.
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Alibaba’s self-driving robots deliver more than 1 million orders
Alibaba DAMO Academy, a global research initiative set up by Alibaba Group, reports that the last-mile logistics vehicle “Xiaomanlv”, developed by its autonomous driving lab, has delivered over one million shipment orders as of September 2021.
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Dongfeng Motor Group and Ambarella partner on AI-led driver monitoring system for mass production vehicle
Ambarella, Inc., an AI vision silicon company, announced that it partnered with Dongfeng Fengshen (Aeolus), a mid-to-high-end brand of the Dongfeng Motor Group, to build a Driver Monitoring System (DMS) based on Ambarella’s CV25 AI vision SoC and development platform. The first mass-production application of this system is in the Dongfeng Fengshen Yixuan Max, which launched on September 1st.
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